Wafer surface analysis

Materials in cleanrooms continually outgas (release) molecular contamination (MC) into the cleanroom air and also absorb chemicals from the air, which may be released later.
Molecular contaminants typically exist as airborne, single molecules which can condense or agglomerate on surfaces, including silicon wafers, within the cleanroom and other wafer environments.
Wafer surface outgassing
The material heated by infrared, and the volatile air concentrated and introduced into a outgassing analysis system.
Wax surface trace element detection, test method for measuring surface
metal contamination of polycrystalline silicon by acid extraction-atomic absorption spectroscopy (ICPMS)

Semiconductor process contamination; Wafer materials ; Defective products